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? 1995 data sheet bipolar analog integrated circuit m m m m m pc2723t 1.1 ghz agc amplifier for dbs tuner and mobile telephone features wide frequency response C f u = 1.1 ghz typ @ C 3 db g pmax. maximum power gain C g pmax. = 13 db typ single supply voltage: 5 v, 15 ma typ. agc dynamic range: gcr = 38 db typ. @ f = 500 mhz packaged in 6 pins mini mold suitable for high-density surface mounting. description the m pc2723t is a silicon monolithic integrated circuit designed for miniature agc amplifier. this amplifier realizes auto gain control with external control circuit. this ic operates up to 1.1 ghz and therefore is suitable for dbs tuner, mobile telephone and other applications. the m pc2723t is manufactured using necs 20 ghz f t nesat? iii silicon bipolar process. this process uses silicon nitride passivation film and gold metallization wirings. these materials can protect the chips from external pollution and prevent corrosion/migration. thus, this ic has excellent performance, uniformity and reliability. order information order number package supplying form marking m pc2723tCe3 6pin mini mold embossed tape 8mm wide. 3kp/reel. c1m pin1, 2, 3 face to perforation side of the tape. caution: electro-static sensitive device 3 2 1 4 5 6 c1m (top view) 3 2 1 4 5 6 (bottom view) 1. 2. 3. 4. 5. 6. input gnd output v cc v agc input document no. p10922ej2v0ds00 (2nd edition) (previous no. id-3258) date published november 1995 p printed in japan remarks to order evaluation samples, please contact your local nec sales office. (order number: m pc2723t) pin connections
2 m m m m m pc2723t absolute maximum ratings recommended operating conditions parameter symbol min. typ. max. unit supply voltage v cc 4.5 5 5.5 v operating temperature t opt C40 +25 +85 c electrical characteristics (t a = 25 c, v cc = 5 v, z s = z l = 50 w ) parameter symbol min. typ. max. unit condition circuit current i cc 11 15 19 ma no signal maximum power gain g pmax. 9.5 13 14.5 db f = 500 mhz noise figure nf C 11 13.5 db f = 500 mhz, at g pmax. upper limit operating frequency f u 0.8 1.1 C ghz 3 db down below flat gain f = 0.1 ghz at g pmax. agc dynamic range gcr 33 38 C db f = 500 mhz, v agc = 0 to 5.0 v isolation isl 32 37 C db f = 500 mhz, at g pmax. input return loss rl in 9 12 C db f = 500 mhz, at g pmax. output return loss rl out 2 4 C db f = 500 mhz, at g pmax. maximum output p o(sat) C5 C2 C dbm f = 500 mhz, p in = C5 dbm at g pmax. parameter symbol rating unit condition supply voltage v cc 6.0 v t a = +25 c agc control voltage v agc 6.0 ma t a = +25 c total power dissipation p d 280 mw mounted on double sided copper 50 50 1.6 mm epoxy glass pwb (t a = +85 c) operating temperature t opt C40 to +85 c storage temperature t stg C55 to +150 c input power p in 0 dbm t a = +25 c
3 m m m m m pc2723t pin descriptions functions and explanation must be connected bypass capacitor (e.g. 1 500 pf) to minimize ground impedance. must be connected to the system ground with minimum inductance. ground pattern on the board should be formed as wide as possible. (track length should be kept as short as possible) must be coupled with capacitor (e.g. 1 500 pf) for dc cut. supply voltage 5.0 0.5 v for operation. must be connected bypass capacitor (e.g. 1 500 pf) to minimize ground impedance. can be used for auto gain control. the control can be governed by supply voltage to this pin. agc performance can be adjustable by r agc value. (e.g. 15 w ). input frequency from an external vco output. must be coupled with capacitor (e.g. 1 500 pf). pin no. symbol assignment 1 in input bypass pin 2 gnd ground pin 3 out output pin 4v cc power supply pin 5v agc agc control pin 6 in input pin
4 m m m m m pc2723t test circuit 1 2 3 4 5 1 500 pf c 2 50 w out c 6 1 500 pf c 3 1k w c 5 r agc 1 500 pf v agc c 4 0.68 f v cc? tantalum capacitor 1 500 pf 50 w in 6 c 1 1 500 pf m internal block diagram v agc level shifter level shifter agc amp rf in in (bypass) rf out
5 m m m m m pc2723t typical characteristics (t a = +25 c) 10 0 10 1 2 3 4 5 6 5 20 15 20 ?0 0 ?0 ?0 10 0 20 2 4 6 0 20 40 60 80 ?0 ?0 ?0 ?0 ?0 0 20 40 v agc = 3.3 v v agc = 3.6 v v agc = 3.68 v v agc = 3.71 v v agc = 3.8 v 0.01 0.1 1.0 3.0 0.01 0.1 1.0 3.0 20 15 10 5 0 v cc = 5.0 v v agc = 1.0 v v cc = 5.0 v v agc = 1.0 v no input signal v agc = 1.0 v no input signal i cc ?v cc i cc ?t opt g p ?v agc g p ?f nf, g p ?f g p ?f v cc ?supply voltage ?v t opt ?operating temperature ?? f ?frequency ?ghz f ?frequency ?ghz f ?frequency ?ghz v agc ?agc control voltage ?v i cc ?circuit current ?ma i cc ?circuit current ?ma nf ?noise figure db g p ?maximum power gain ?db 5 10 15 g p ?maximum power gain ?db g p ?power gain ?db g p ?power gain ?db v cc = 5.0 v f = 500 mhz v cc = 5.0 v t a = ?0 ? t a = +85 ? t a = +25 ? 5 10 15 20 0.01 0.1 1.0 3.0 0 ? v cc = 5.5 v v cc = 5.0 v v cc = 4.5 v g pmax. v cc = 5.0 v v agc = 1.0 v r agc =1 k w 15 k w
6 m m m m m pc2723t ?0 ?0 ?0 0 20 ?0 ?0 ?0 ?0 ?0 0 10 ?0 ?0 ?0 0 10 v cc = 5.5 v v cc = 5.0 v v cc = 4.5 v ?00 ?0 ?0 ?0 ?0 0 ?0 ?0 ?0 ?0 0 rl in ?0 0.01 ? 0 5 0.1 1.0 3.0 ?00 ?0 ?0 ?0 ?0 ?0 0 +20 ?0 ?0 ?0 ?0 0 im 3 p out 0.01 0.1 1.0 3.0 0.01 0.1 1.0 3.0 f = 500 mhz v cc = 5.0 v f = 500 mhz v agc = 1.0 v at g pmax. v cc = 5.0 v v cc = 5.0 v isl ?f rl in , rl out ?f p o ?p in agc operation p o ?p in manual gain control p o(sat) ?f rl in ?input return loss ?db rl out ?output return loss ?db isl ?isolation ?db f ?frequency ?ghz f ?frequency ?ghz f ?frequency ?ghz p in ?input power ?dbm p in ?input power ?dbm p o ?output power ?dbm p o ?output power ?dbm im 3 ?3rd order intermodulation distortion ?dbm p o ?output power ?dbm p o(sat) ?saturated output power ?dbm ?0 ?0 ?0 ?0 0 ?0 v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v p o , im 3 ?p in rl out p in ?input power ?dbm
7 m m m m m pc2723t s parameter (v cc = 5.0 v) s 11 C frequency a n g l e o f r e f l e c t i o n c o e f f c i e n t i n d e g r e e s ?60 ?50 ?40 ?30 ?20 ?10 ?00 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 0 10 20 30 40 50 00 60 70 80 90 100 110 120 130 140 150 0 0.02 0.48 0.04 0.46 0.06 0.44 0.08 0.42 0.10 0.40 0.12 0.38 0.04 0.36 0.16 0.34 0.18 0.32 0.20 0.30 0.22 0.28 0.24 0.26 0.26 0.24 0.28 0.22 0.30 0.20 0.32 0.18 0.34 0.16 0.36 0.14 0.38 0.12 0.40 0.10 0.42 0.08 0.44 0.06 0.46 0.04 0.48 0.02 0 0.49 0.47 0.45 0.43 0.41 0.39 0.37 0.35 0.33 0.31 0.29 0.27 0.25 0.23 0.21 0.19 0.17 0.15 0.13 0.11 0.09 0.07 0.05 0.03 0.01 0.01 0.03 0.05 000.07 0.09 0.11 0.13 0.15 0.17 0.19 000.21 0.23 0.25 0.27 0.29 0.31 0.33 0.35 0.37 0.39 0.41 0.43 0.45 0.47 0.49 w a v e l e n g t h s t o w a r d l o a d w a v e l e n g t h s t o w a r d g e n e r a t o r 2.0 5.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.2 1.4 1.6 1.8 2.0 3.0 4.0 10 50 20 50 10 6.0 4.0 3.0 1.8 1.6 1.4 0.2 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 20 ( +jx z o ) 0.2 1.0 0.8 0.6 0.4 0.2 0.4 0.6 0.8 1.0 2.0 50 10 6.0 4.0 3.0 1.8 1.6 1.4 1.2 1.0 0.9 0.8 0.7 0.6 0.3 0.2 0.1 20 0.2 1.0 0.8 0.6 0.4 0.2 0.4 0.6 0.8 1.0 0.4 0.5 reactance component ( r z o ) n e g a t i v e r e a c t a n c e c o m p o n e n t ( ?jx z o ) 3.0 g 0.01 g p o s i t i v e r e a c t a n c e c o m p o n e n t s 22 C frequency a n g l e o f r e f l e c t i o n c o e f f c i e n t i n d e g r e e s ?60 ?50 ?40 ?30 ?20 ?10 ?00 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 ?0 0 10 20 30 40 50 00 60 70 80 90 100 110 120 130 140 150 0 0.02 0.48 0.04 0.46 0.06 0.44 0.08 0.42 0.10 0.40 0.12 0.38 0.04 0.36 0.16 0.34 0.18 0.32 0.20 0.30 0.22 0.28 0.24 0.26 0.26 0.24 0.28 0.22 0.30 0.20 0.32 0.18 0.34 0.16 0.36 0.14 0.38 0.12 0.40 0.10 0.42 0.08 0.44 0.06 0.46 0.04 0.48 0.02 0 0.49 0.47 0.45 0.43 0.41 0.39 0.37 0.35 0.33 0.31 0.29 0.27 0.25 0.23 0.21 0.19 0.17 0.15 0.13 0.11 0.09 0.07 0.05 0.03 0.01 0.01 0.03 0.05 000.07 0.09 0.11 0.13 0.15 0.17 0.19 000.21 0.23 0.25 0.27 0.29 0.31 0.33 0.35 0.37 0.39 0.41 0.43 0.45 0.47 0.49 w a v e l e n g t h s t o w a r d l o a d w a v e l e n g t h s t o w a r d g e n e r a t o r 2.0 5.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.2 1.4 1.6 1.8 2.0 3.0 4.0 10 50 20 50 10 6.0 4.0 3.0 1.8 1.6 1.4 0.2 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 20 ( +jx z o ) 0.2 1.0 0.8 0.6 0.4 0.2 0.4 0.6 0.8 1.0 2.0 50 10 6.0 4.0 3.0 1.8 1.6 1.4 1.2 1.0 0.9 0.8 0.7 0.6 0.3 0.2 0.1 20 0.2 1.0 0.8 0.6 0.4 0.2 0.4 0.6 0.8 1.0 0.4 0.5 n e g a t i v e r e a c t a n c e c o m p o n e n t ( ?jx z o ) 0.1 g 3.0 g ( r z o ) reactance component p o s i t i v e r e a c t a n c e c o m p o n e n t
8 m m m m m pc2723t illustration of the test circuit assembled on evaluation board no. value c 1 to 3 1 500 pf c 4 0.68 pf c 5 to 6 1 500 pf r agc 1 k w component list note (1) 50 50 0.4 mm double copper clad polyimide board. (2) back side: gnd pattern (3) solder plated on pattern (4) l l l l : through holes 8 v cc out in v agc c5 c6 c4 c3 c1 c2 pc2723t m r agc
9 m m m m m pc2723t typical system application dbs tuner block diagram sound visual fm demo. pc2726t pc2723t det dc amp mix. if amp rf amp att rf amp 1st if input from o.d.u. pll vco m m lpf 900 mhz band digital cellular block diagram (5 v system) rx low noise tr 1st mix. 2nd mix. pll pll 90? 0? pc2723t driver pa vco sw tx i q i q demo. f/f m the application circuits and their parameters are for references only and are not intended for use in actual design-in's.
10 m m m m m pc2723t 6 pins mini mold package dimensions (unit : mm) 0.13?.1 0.3 +0.1 ?.05 0.8 1.1 +0.2 ?.1 0 to 0.1 123 65 4 1.9 2.9?.2 0.95 0.95 1.5 +0.2 ?.1 2.8 +0.2 ?.3
11 m m m m m pc2723t note on correct use (1) observe precautions for handling because of electro-static sensitive devices. (2) form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). (3) keep the wiring length of the ground pins as short as possible. (4) connect a bypass capacitor (e.g. 1 000 pf) to the v cc pin. recommended soldering conditions this product should be soldered in the following recommended conditions. other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. m pc2723t soldering method infrared ray reflow vps wave soldering pin part heating soldering conditions package peak temperature: 235 c, hour: within 30 s. (more than 210 c), time: 2 times, limited days: no. * package peak temperature: 215 c, hour: within 40 s. (more than 200 c), time: 2 times, limited days: no. * soldering tub temperature: less than 260 c, hour: within 10 s. time: 1 time, limited days: no. pin area temperature: less than 300 c, hour: within 3 s/pin. limited days: no. * recommended condition symbol ir35C00-2 vp15C00-2 ws60C00-1 *: it is the storage days after opening a dry pack, the storage conditions are 25 c, less than 65 % rh. note 1. the combined use of soldering method is to be avoided (however, except the pin area heating method). for details of recommended soldering conditions for surface mounting, refer to information document semiconductor device mounting technology manual (iei-1207).
14 m m m m m pc2723t nesat (nec silicon advanced technology) is a trademark of nec corporation. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. nec devices are classified into the following three quality grades: standard, special, and specific. the specific quality grade applies only to devices developed based on a customer designated quality assurance program for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices in standard unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact nec sales representative in advance. anti-radioactive design is not implemented in this product. m4 94.11 attention observe precautions for handling electrostatic sensitive devices

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